Cooler Master RR-T800-FLNN-R1 Ficha de datos descargar pdf

 The TPC 800 uses 2 separate cooling technologies to

transfer heat – heat pipes and vertical vapor

chambers.

 The first-ever CPU heatsink to use vertical vapor

chamber technology.

 100% pure polished copper base – combined with

improved soldering technologies for the best

thermal transfer.

 Special fin design – heatsink receives concentrated

cold airflow.

 Improved air pressure design and fan mounting

system.

TPC 800 is the Cooler Master Reference Cooler for

optimal Performance and is a high end cooling system

with perfect performance for overclocking. TPC 800 is

the first-ever CPU heatsink to use vertical vapor

chamber technology and combine it with heatpipe

technology: the synergy of both technologies working

in tandem delivers the top cooling performance.

CPU Socket

Intel® LGA 2011/1366/1156/1155/775

AMD FM1/AM3+/AM3/AM2+/AM2

Dimensions 134 x 74 x 158 mm (5.3 x 2.9 x 6.2 in)

Heat Sink Material

Copper Base / 2 Vapor Chambers

6 Heatpipes / Aluminum Fins

Heat Sink Weight 826g (1.83 lb)

Heat Pipe Dimensions Ø6mm

EAN Code 4719512037706

UPC Code 884102017209

Package Dimensions 182 x 118 x 192 mm

(7.17 x 4.65 x 7.56 in)

Carton Dimensions 485 x 377 x 216 mm

(19.09 x 14.84 x 8.50 in)

Unit / Carton 8

Carton / Pallet 48

TPC 800

RR-T800-FLNN-R1

2 years

Features

Specifications

Package Information

Warranty

1 2

RR-T800-FLNN-R1 1
Appendix 2

Indice de contenidos

Pagina 1 - RR-T800-FLNN-R1

 The TPC 800 uses 2 separate cooling technologies to transfer heat – heat pipes and vertical vapor chambers.  The first-ever CPU heatsink to

Pagina 2 - Appendix

Synergy cooling: Vapor chamber + Heatpipe Vertical vapor chamber Pure polished copper base Special fin design Note: Photos may differ sl

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Cooler Master RR-T800-FLNN-R1 Ficha de datos

Busca en linea o descarga Ficha de datos para Componentes De Refrigeración Del Ordenador Cooler Master RR-T800-FLNN-R1. Cooler Master TPC 800 Manual de usuario

Indice de contenidos

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